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“ Patni’s challenge towards quality improvement and high productivity has led to one of our best practices of effective usage of overseas outsourcing.”
Kunio Takezawa
GM, Information Systems Center
Toshiba Corporation
 
 
Case Study
 

Low Power Mixed Signal ASIC Design

The Challenge The Solution The Benefits
By engaging Patni's services from the concept to the design stage, a leading technology company created a low power consumption chip in record time.

The Challenge

The customer's principal product line had been implemented using off the shelf components. The client was informed that the primary device would be going end-of-life shortly and they had to make a lifetime buy decision. This key component had been designed by a sister division who by this time had been sold off and thus the human and technical assets needed to do a re-design were no longer available. After completion of a preliminary discovery period, it was agreed the customer:

Needed a replacement device with extremely low power consumption (2 microamps)
That such an power-constrained implementation would be difficult to attain in any technology
Needed to quickly evaluate feasible options, select an appropriate technology and initiate implementation
Had to call upon on a 3rd party partner that had both the technological, domain expertise and bandwidth that could design, debug and deliver the chip in the requisite (albeit, short) time.
 

The Solution

Patni's experienced engineers examined the feasibility of the project by:

Investigating alternate implementation technologies for power consumption and analog capabilities
Submitting RFQs to Silicon vendors and obtain best pricing on qualifying technologies

An appropriate Patni team was assembled to propose the complete solution including:
Developing a detailed engineering plan and work breakdown schedule
Initiating and managing a 3rd party for Silicon place and route
Identifying and managing the Silicon vendor interface

Implementation of the final design:
Developed the design specification for single-chip implementation
Implemented the digital design in Verilog HDL
Synthesized the digital logic into a netlist
Integrated the digital design with the analog blocks
Created manufacturing test vectors
Secured sign off of the ASIC design with the silicon vendor
Assisted the customer in bringing up the device in the lab
 

The Benefits

The completed chip, running at the required performance was delivered on time
The chip actually required 5% less power than the original design target
Accounting only for the direct expenses the total cost to the customer was approximately 20% of what the customer would have incurred had he attempted to do the job in house.
 

Patni Assets Deployed

Project Management
ASIC Design & Verification
Mixed Signal Design

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